Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e7584a4b4b7e7300b30137d6e151fa1b http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_82a9e22a923eca64a02a97f0dfb493ed http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7212b08200b390e3dccb58e6f31bcafa http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_2572eea64db35863f24d0a92c50e0699 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05022 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73203 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13155 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00014 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13147 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13166 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05647 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0401 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-131 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-014 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05572 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0557 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01078 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15311 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01057 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16227 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-13 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05666 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05147 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-06568 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13083 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01033 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16145 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-06541 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-06513 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01029 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-06517 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-563 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3128 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3135 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-0657 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3142 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3192 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-293 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-065 |
classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-065 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 |
filingDate |
2011-02-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_64ab372559e7f6e8ca4c4dd1ea123598 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a4a78e39dba8f63af4a9e92c9564e13b http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9769ce1b480b80c61710d80f81361402 |
publicationDate |
2011-08-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
WO-2011097464-A1 |
titleOfInvention |
Surface preparation of die for improved bonding strength |
abstract |
A surface preparation method for improved adhesion in an electronic package system. The method of improving adhesion in the electronic package system includes depositing a passivation layer on a bonding surface and roughening at least a portion of the passivation layer. A coating material is deposited on the passivation layer. The bonding surface can be part of a semiconductor or package substrate. The roughening process can be performed by a chemical or mechanical process. In another embodiment, an electronic package system includes a bonding surface of a semiconductor or package substrate. A passivation layer is deposited on the bonding surface and a portion of the passivation layer is roughened for improved adhesion. A coating material is deposited on the roughened portion of the passivation layer. |
priorityDate |
2010-02-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |