| abstract |
Disclosed are: a reducing agent composition for a conductive metal paste, which improves pot life of the conductive metal paste and suppresses changes in the connection resistance thereof; a method for producing a reducing agent composition for a conductive metal paste; and a conductive metal paste.nSpecifically disclosed is a reducing agent composition for a conductive metal paste, which contains an organic aluminum compound and at least one compound selected from the group consisting of hydroxyquinoline compounds, aromatic amino alcohol compounds, aromatic amine compounds, anthraquinone compounds, indole compounds and indane compounds. Also specifically disclosed are: a conductive metal paste which contains the reducing agent composition for a conductive metal paste, conductive metal particles and a resin; and a method for producing a reducing agent composition for a conductive metal paste, which comprises a step of mixing the above-described compound and an organic aluminum compound at a temperature of 5-30°C for a time period of 30 minutes or less. |