http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2011065723-A2
Outgoing Links
Predicate | Object |
---|---|
assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7025dd521889319fc74da2dc8da0e31a http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_8d0fc2b70675ee19bd5fc464f5ae9061 |
classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-0093 |
classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-647 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-02 |
filingDate | 2010-11-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_94add63359ef27a886841fa662452210 |
publicationDate | 2011-06-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | WO-2011065723-A2 |
titleOfInvention | Vertical-structure semiconductor light emitting element and a production method therefor |
abstract | The present invention relates to a vertical-structure semiconductor light emitting element and to a production method therefor, and more specifically relates to a vertical-structure semiconductor light emitting element having a high-performance heatsink support comprising a thick metal film or metal foil. The vertical-structure semiconductor light emitting element produced in accordance with the present invention constitutes a highly reliable light emitting element with absolutely no thermal or mechanical damage since it has the high-performance heatsink support and so suffers no fine microcracking and can be freely subjected to heat treatment and to post-processing including of a side-surface passivation thin film. |
priorityDate | 2009-11-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 38.