| abstract |
Disclosed is a method for manufacturing a light emitting diode unit, which has a step wherein an LED chip is placed on a lower molding die; a step wherein a phosphor material is supplied to the surface of the LED chip; and a step wherein the phosphor material is encapsulated using a glass member by dropping a molten glass droplet at a temperature higher than that of the lower molding die and solidifying the droplet on the lower molding die, which has placed thereon the LED chip having the phosphor material supplied thereon. Thus, the light emitting diode unit can be manufactured in a short time, while suppressing deterioration and breakage of the LED chip phosphor layer and the like. |