| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_802b16f7b5179d63d6984c9fbe5edabe
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_034e604609096b44f0c82da0db6f5ebf
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_dc9367e3586bd91985ce257ddb9c5907
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_bf791b713a2e1e845ad27a99816a254d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_8e0bf0928b608797b70bbc2b91c7e52e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_42188412d11a11a6ff7c07b39b899b70
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1ffd651f31c19e05801e9215a919c3f8
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a48956266f63ae9f431456118a5b2c88
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5bdca878b60827974e45d2b2332f506f |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1463
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3212
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-02 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-463
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09G1-02 |
| filingDate |
2010-11-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_53748a6e4c4aedb26496e31e05a344be
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_69a074c0c46c8b89f60f7a7b4e63df0d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6b21010fabfcad90d353bfa5ce2ff182
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e9f0360b1781d7ebbe859d07c25904ef
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_621c425324790eb22ac7a53718bc080e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7647e7c3516a73ffa5218ccfff620398
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_52a92e55f55a6904cfd6ae4e29bdf439 |
| publicationDate |
2011-06-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2011064734-A1 |
| titleOfInvention |
Process for removing a bulk material layer from a substrate and a chemical mechanical polishing agent suitable for this process |
| abstract |
A process for removing a bulk material layer from a substrate and planarizing the exposed surface by CMP by (1 ) providing an CMP agent exhibiting at the end of the chemical mechanical polishing, without the addition of supplementary materials, the same SER as at its start and a lower MRR than at its start, - an SER which is lower than the initial SER and an MRR which is the same or essentially the same as the initial MRR or a lower SER and a lower MRR than at its start; (2) contacting the surface of the bulk material layer with the CMP agent; (3) the CMP of the bulk material layer with the CMP agent; and (4) continuing the CMP until all material residuals are removed from the exposed surface; and a CMP agent and their use for manufacturing electrical and optical devices. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9963634-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-103173128-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-2594618-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I574779-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9023116-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9328247-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-103173128-B |
| priorityDate |
2009-11-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |