| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ecab07b341526b483dea33d35ab714ae
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_95e7278486e9ba6a3c0365c6c302909f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0c3ccd8a8bdb6834076fc6bb69e7a35d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_67e0004fb74ac14f147249a2dd56ef39
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_86957a6affe953215c80746e48f5e3b4 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-105
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-125
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-121 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-105
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-125
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C07F1-005
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C07F9-5045
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D11-101
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D11-322
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D11-52 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-06 |
| filingDate |
2010-11-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2ae074ee0c89f3043f40c346eb097467
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3bd0fd6edaefc689ad6d4ea421814a72
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8248bc5e8a4c412f747674975bc42315
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_08e67b7277432637615e54d326f4bb07 |
| publicationDate |
2011-05-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2011057218-A2 |
| titleOfInvention |
Metal ink compositions, conductive patterns, methods, and devices |
| abstract |
Metal complexes adapted to form conductive metal films and lines upon deposition and treatment. The metal complex can be a covalent complex and can comprise a first and second ligand. Low temperature treatment can be used to convert the complex to a metal. The metal films and lines can have low resistivity and work function similar to pure metal. Coinage metals can be used (e.g., Ag, Au, Cu). The ligands can be dative bonding ligands including amines, unsymmetrical amines, and carboxylate ligands. Sulfur complexes can be used. Carboxylate ligands can be used. The complexes can have a high concentration of metal and can be soluble in aromatic hydrocarbon solvent. The ligands can be adapted to volatilize well. Inkjet printing can be carried out. High yields of metal can be achieve with high conductivity. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10590295-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2013130450-A3
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20140021735-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9758688-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102009320-B1 |
| priorityDate |
2009-11-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |