| abstract |
Provided is a technique for packaging: a sensor structure (300) having a contact sensing surface; and a signal processing LSI unit (420) for processing the sensor signals from said sensor structure (300). The sensor structure (300) is provided with said contact sensing surface and sensor electrodes (320 and 330). A semiconductor substrate (400) is incorporated with a signal processing integrated circuit (420). The sensor structure (300) and the semiconductor substrate (400) are joined together with an adhesive layer (500), thereby integrating a sensor device (200) into one chip. The sensor electrodes (320 and 330) and the integrated circuit (420) are encapsulated inside the sensor device (200), and the external terminals of the sensor electrodes (320 and 330) and the integrated circuit (420) are pulled out from the back surface of the semiconductor substrate (400) via the side surface of the semiconductor substrate (400). |