| abstract |
Disclosed is a conductive coating film-forming agent which contains a coating film-forming component having a polyol structure, and at least one compound selected from bis(fluorosulfonyl)imide salts represented by the formula (FSO 2 ) 2 N·X. The conductive coating film-forming agent remains soluble in the coating film-forming component, exhibits excellent conductivity, even under high-temperature operating conditions, is easily handled and has no environmental impact. |