http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2011037758-A1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_fff47300d7e0e09b1e5990e38a2c8195 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_efe7d5c2ad7b79197fa9822b88d8f44e http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d6d5235e6c1c34796fbb3f5f36ffd279 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G11C29-808 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G06F11-00 |
| filingDate | 2010-09-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5f44fbb1caa2371ba4174e80e4a6a774 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_54b3fa587d2443768232a1c07b0ebecb |
| publicationDate | 2011-03-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | WO-2011037758-A1 |
| titleOfInvention | Characterization and repair of integrated circuits |
| abstract | In a method of characterizing an integrated circuit, memory blocks are depicted in graphical and computer-readable text formats. Redundant elements are depicted in these formats. Possible placements of the redundant elements are described in the graphical and computer-readable text formats. Constraints on placements of the redundant elements are also described. The depictions of the memory blocks and redundant elements, and the descriptions of the possible placements and constraints, are combined into overall graphical and computer-readable textual descriptions of the integrated circuit. Also disclosed are a method of generating a repair algorithm for an integrated circuit, and a method of, and system for, repairing an integrated circuit. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-3992972-A4 |
| priorityDate | 2009-09-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 23.