| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c3730e0af01e37f843734aa56aea074d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_8e0bf0928b608797b70bbc2b91c7e52e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c7722fbd186927a4d25669eed33b841a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b2c6fd6d724f1af8da529dff49366c22 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76877 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-2885
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-123
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76898
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-12 |
| filingDate |
2010-09-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0a2ec69a09d8082ae71a3e8d13090388
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4444aa32daf0c459dafc24507c266552
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_61eb8717fb8fdb2499fe4dfb923b94a0 |
| publicationDate |
2011-03-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2011036158-A2 |
| titleOfInvention |
Wafer pretreatment for copper electroplating |
| abstract |
The present invention is directed to a pretreatment process for copper electroplating of via or trench features on a wafer, comprising filling the via or trench feature with a pretreatment solution, wherein the pretreatment solution comprises copper ions. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2014299476-A1 |
| priorityDate |
2009-09-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |