| abstract |
Disclosed is a resist stripper composition for forming copper-based wiring, which uses a compound containing sulfone and/or sulfine and/or an ester as the stripper and which can effectively prevent the corrosion of a conductive metal layer of copper or copper alloy wiring and an insulating layer of silicon oxide or silicon nitride which are disposed under the resist, even without the use of isopropanol as an intermediate cleaner, and also can cleanly remove the deteriorated and/or cured resist even at low temperature in a short period of time. |