| abstract |
Disclosed is a photocurable resin composition which enables the prevention of absorption of moisture, and can be cured into a product that has improved thermal cycle resistance without deteriorating anti-migration properties when the product is used in a printed wiring board or the like. The photocurable resin composition comprises a resin containing a carboxyl group, a photopolymerization initiator, a compound containing a styryl group, and a maleimide compound. |