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filingDate 2009-07-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_35b22d2b6831e52a18d286fa829f2be5
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publicationDate 2011-01-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber WO-2011001007-A1
titleOfInvention Manufacturing of electronic components
abstract According to an aspect of the invention, a method is provided for manufacturing electronic components. A conducting element comprising a first portion, a second portion and a third portion between the first portion and the second portion is provided. Thermally responsive dielectric material is added at least onto the third portion of the conducting element. Electric current is supplied between the first portion and the second portion of the conducting element causing ohmic heating to affix dielectric material located on the third portion to the third portion. Non- thermaliy-affixed dielectric material is removed.
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