| abstract |
In an organic electronics panel using a flexible substrate, a method for removing an electrode lead in a small space without deteriorating a sealing property while the conductivity and the adhesion thereof are sufficiently maintained, is provided. Disclosed is an organic electronics panel wherein an organic electronics element configured so that a pair of electrodes are provided on a supporting substrate, and an organic compound layer containing a function layer composed of at least an organic compound is sandwiched by the pair of electrodes, is hermetically sealed by holding the electrodes and the organic compound layer between a sealing member covering the organic electronics element and the supporting substrate. It is characterized in that a joint portion of a pulling portion of each electrode and an electrode lead connected to an outside drive circuit is disposed within an area covered and hermetically sealed by the sealing member, and the electrode lead is removed from the hermetically sealed area. |