http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2010140889-A1

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filingDate 2010-06-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2010-12-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber WO-2010140889-A1
titleOfInvention Method for passivating at least a part of a substrate surface
abstract A method for passivating at least a part of a surface of a semiconductor substrate, wherein at least one layer comprising at least one a-Si:H passivation layer is realized on said part of the substrate surface by: - generating a plasma (P) by means of at least one plasma source (3) mounted on the process chamber (5) at a distance (L) from the substrate surface, at least part of the plasma (P) being injected into the chamber (5) and achieving a supersonic speed; - contacting at least a part of the plasma (P), injected into the chamber (5), with the said part of the substrate surface; and - supplying at least one precursor suitable for passivation layer realization to the said part of the plasma (P) via a plurality of injection nozzles (19) of an injector device (17), such that the density of the precursor at each injection nozzle (19) is lower than 12x10 22 particles/m 3 .
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10020187-B2
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priorityDate 2009-06-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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