| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_305d8b5ee30e0ce05c0cc810a85d1498
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c8788ca6f36e343489390210f7c0e66e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_92a9d20fd1d57442c3259ebd13f0ce6b |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G2110-0066
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L27-18 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L75-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G18-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G18-222
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24D13-14 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24D13-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-04 |
| filingDate |
2010-05-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c5fc5f4d967c2868b55a3cf289a6e14a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_036825d36dac2c09800fc39dd06646fa |
| publicationDate |
2010-12-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2010138724-A1 |
| titleOfInvention |
Polishing pad, polyurethane layer therefor, and method of polishing a silicon wafer |
| abstract |
A polyurethane layer for forming a polishing pad for a semiconductor wafer is described, wherein the polyurethane layer comprises: a foamed polyurethane, wherein the polyurethane foam has a density of about 640 to about 960 kg/m3, and a plurality of cells having an average diameter of about 20 to about 200 micrometers; and particles of a hydrophobic polymer having a critical surface energy of less than 35 mN/m and having a median particle size of 3 to 100 micrometers. Polishing pads as well as methods for polishing are also described. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-116000799-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-116000799-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013125969-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015510847-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-103059551-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-103059551-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111212705-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-115716985-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111212705-B |
| priorityDate |
2009-05-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |