http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2010134314-A1
Outgoing Links
Predicate | Object |
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assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5b3adffef1ecab0a7812a2b3a73f9da0 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_04ed45ce45e58f237cec7a815169254a http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_eedd2a00c4d0ba56ecf05fb4b97592dd |
classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-287 |
classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L101-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-038 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-033 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-28 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-033 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-038 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28 |
filingDate | 2010-05-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d11bc4132e81f79d0234efbb00fa1695 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9f8f705cc7a12c9977947b4c03413d03 |
publicationDate | 2010-11-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | WO-2010134314-A1 |
titleOfInvention | Photocurable heat-curable resin composition, dry film and cured product of the composition, and printed wiring board utilizing those materials |
abstract | Disclosed are: a photocurable heat-curable resin composition which enables the formation of a cured coating film having PCT resistance, HAST resistance, electroless gold plating resistance and thermal shock resistance that are important properties for solder resists for semiconductor packages; a dry film and a cured product of the resin composition; and a printed wiring board having, formed thereon, a cured coating film (e.g., a solder resist) comprising those materials. Specifically disclosed is a photocurable heat-curable resin composition which is developable with an aqueous alkaline solution and comprises a carboxyl-group-containing resin having a photosensitive group (excluding a carboxyl-group-containing resin produced using an epoxy resin as a starting raw material), a photopolymerization initiator and a hydroxyl-group-containing elastomer. |
priorityDate | 2009-05-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
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