| abstract |
An epoxy resin composition comprises an epoxy resin, a phenolic resin, a curing accelerator and an inorganic filler. The epoxy resin comprises: 1.) 20-50% compound represented by formula I; 2.) 10-40% compound represented by formula II; and 3.) 0-30% compound represented by formula III and/or 0-40% compound represented by formula IV, in which compounds represented by formula III and formula IV can not be 0% simultaneously. Therein, R 1 and R 2 independently are H or C 1 -C 6 alkyl; in formula I, n is an integer between 0 and 50 inclusive; the ratio of the number of phenolic hydroxyl in the phenolic resin to the number of epoxy groups in the epoxy resin mixture is 0.8 to 1.3; all the percentages are relative to the total mass of epoxy resin mixture. The epoxy resin composition provided is environment-friendly, is capable of meeting high-temperature lead-free reflow process, and has high reliability and low warping properties. |