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publicationDate 2010-09-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber WO-2010110892-A1
titleOfInvention Configuration and fabrication of semiconductor structure having extended-drain field-effect transistor
abstract An extended-drain insulated-gate field-effect transistor contains first and second source/drain zones laterally separated by a channel zone constituted by part of a first well region A gate dielectric layer overlies the channel zone A gate electrode overlies the gate dielectric layer above the channel zone The first source/drain zone is normally the source The second S/D zone, normally the drain, is at least partially constituted with a second well region A well-separating portion of the semiconductor body extends between the well regions and is more lightly doped than each well region The configuration of the well regions cause the maximum electric field in the IGFETs portion of the semiconductor body to occur well below the upper semiconductor surface, typically at or close to where the well regions are closest to each other The IGFET's operating characteristics are stable with operational time.
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