| abstract |
A method of producing a semiconductor device in which a semiconductor chip is flip-chip mounted on a board with a non-conductive resin film (NCF), wherein said method prevents the NCF from protruding at the time of hot pressing, prevents non-conductive resin and inorganic filler from entering the space between the bumps and the electrode pads, and wherein the acquired semiconductor device exhibits sufficient moisture/reflow resistance. Specifically, the NCF has a size equivalent to 60 to 100% of the area of a region enclosed by a plurality of bumps that are arranged at the periphery of a semiconductor chip and has a minimum melt viscosity of 2×10 2 to 1×10 5 Pa⋅s. The NCF is temporarily bonded to a region enclosed by a plurality of electrodes of the board which correspond to the bumps. Next, the semiconductor chip and board are positioned so that the bumps and the corresponding electrodes face each other, and are hot pressed from the semiconductor chip side. This causes the bumps and the electrodes to metallically bond, and melts and further thermally hardens the NCF. Due to this, a semiconductor device is acquired. |