Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_8b5407aa936b81f88838e9dd72836c99 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6af218e647bc968bed57daf4bf9abf73 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c62268de3e92657ca5b9adcac4778225 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C01P2004-61 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C01P2002-85 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C01P2004-32 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-2982 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C01P2006-42 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C01F7-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C01F7-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-298 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B01J2-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C01B33-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-293 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C01B33-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C01B33-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C01F7-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C01F7-02 |
filingDate |
2009-10-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d3947d10850f7b20b2a192b1afc51907 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_28d20cd0065fab52ba5c73ecb6395047 |
publicationDate |
2010-07-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
WO-2010073457-A1 |
titleOfInvention |
Powder, method for producing same, and resin composition containing same |
abstract |
Provided is a semiconductor sealing material in which the contamination rate of conductive foreign matter is extremely low. Further provided are powder comprising spherical silica powder and/or spherical alumina powder suitable for preparing such a semiconductor sealing material, a method for producing the same, and a resin composition. The powder comprises spherical silica powder and/or spherical alumina powder, and when a color reaction test for particles using an aqueous potassium ferricyanide solution under specific conditions is performed for magnetizable particles having a particle size of 45 μm or more, the ratio of the number of particles which develop color to the total number of the magnetizable particles is 20% or less. Such powder can be produced by supplying a specific amount of oxygen gas and/or water vapor to at least one arbitrary site at which the atmospheric temperature is 1600 to 1800˚C in a furnace at an angle of 60˚ to 90˚ with respect to the injection direction of a starting material of the powder, and setting the relative velocity of the starting material of the powder and/or the spherical powder to stainless steel and/or iron to 5 m/s or less. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012206870-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015086120-A |
priorityDate |
2008-12-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |