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filingDate 2009-10-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d3947d10850f7b20b2a192b1afc51907
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publicationDate 2010-07-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber WO-2010073457-A1
titleOfInvention Powder, method for producing same, and resin composition containing same
abstract Provided is a semiconductor sealing material in which the contamination rate of conductive foreign matter is extremely low.  Further provided are powder comprising spherical silica powder and/or spherical alumina powder suitable for preparing such a semiconductor sealing material, a method for producing the same, and a resin composition.  The powder comprises spherical silica powder and/or spherical alumina powder, and when a color reaction test for particles using an aqueous potassium ferricyanide solution under specific conditions is performed for magnetizable particles having a particle size of 45 μm or more, the ratio of the number of particles which develop color to the total number of the magnetizable particles is 20% or less.  Such powder can be produced by supplying a specific amount of oxygen gas and/or water vapor to at least one arbitrary site at which the atmospheric temperature is 1600 to 1800˚C in a furnace at an angle of 60˚ to 90˚ with respect to the injection direction of a starting material of the powder, and setting the relative velocity of the starting material of the powder and/or the spherical powder to stainless steel and/or iron to 5 m/s or less.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012206870-A
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priorityDate 2008-12-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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