| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_152814141d36f8f7d13790341d9a482a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_bf99ca4588ecc0292dc2298fba759626
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_bf0c972f88ef758603cd1ce267483e33 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J151-003
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0385
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-3218
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-038
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F290-064
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L51-003
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-14618 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-032
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F290-14 |
| filingDate |
2009-11-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6687ee811f238e4d7b1c5d95d1c8568e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f7498ba84f718200151b3fac7ebbb94c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0bb362e4edc31c4af01949d9aa8d90a7 |
| publicationDate |
2010-05-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2010053207-A1 |
| titleOfInvention |
Photosensitive resin composition, photosensitive adhesive film, and light-receiving device |
| abstract |
Disclosed is a photosensitive resin composition which is characterized by comprising an alkali-soluble resin (A), an epoxy resin (B) and a photopolymerization initiator (C), wherein the epoxy resin (B) comprises an epoxy resin having a naphthalene skeleton and/or an epoxy resin having a triphenylmethane skeleton. The photosensitive resin composition enables the prevention of occurrence of dew condensation in a semiconductor device comprising a spacer comprising a photosensitive adhesive film produced from the photosensitive resin composition, a semiconductor wafer and a transparent substrate. Also disclosed is a photosensitive adhesive film comprising the photosensitive resin composition. Further disclosed is a light-receiving device having excellent reliability. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2011115100-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-115236938-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-115236938-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011197269-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012113056-A |
| priorityDate |
2008-11-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |