| abstract |
A multilayer printed wiring board is provided with: a first insulating interlayer resin layer; a first conductor circuit formed on the first insulating interlayer resin layer; a second insulating interlayer resin layer, which is formed on the first insulating interlayer resin layer and the first conductor circuit and has an opening section reaching the first conductor circuit; a second conductor circuit formed on the second insulating interlayer resin layer; and a via conductor, which is formed in the opening section and connects the first conductor circuit and the second conductor circuit with each other. On a surface of the first conductor circuit, a metal layer containing at least one kind of metal selected from among a group composed of Sn, Ni, Zn, Co, Ti, Pd, Ag, Pt and Au is formed, and on the metal layer, a film composed of a coupling agent is formed. At least a part of the bottom portion of the via conductor is directly connected with the first conductor circuit. |