| abstract |
Disclosed herein are engineered microscale particle based material suitable for applications that can benefit from a microscale particle based material capable of interacting with or responding to, in a controlled or predetermined manner, changes in its surrounding environment. The microscale particle based material generally includes a densely packed particle structure including densely packed microscale particles, wherein particles of the densely packed particle structure are positioned with respect to each other such that at least some of the particles get into contact with each other during interaction with a compression wave, thereby attenuating the compression wave propagating in the densely packed particle structure. |