| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_892fc661244128be5e459fc15203781f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f7d2667cefec164c51cebc3700c2d5b5
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d8f216db013f5aa0194933cd48e096c6
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_51bf12e688e79c8a708aa9c9c193586e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_082507838ffd3a482218a2d116731fbd |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48465
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-16235 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C03C3-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C03C8-245
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C03C8-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C03C3-066
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C03C3-072 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C03C8-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C03C3-00 |
| filingDate |
2009-07-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_aa106511189c255fd8689cfc5488004f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_848c9126747a151f3ec82fd6731bacc6
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_28fe145e2446b8b854aa85dbd686f412
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4d06e1088139e79fd32b2ce902a46a14 |
| publicationDate |
2010-01-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2010009213-A1 |
| titleOfInvention |
Hot-melt sealing glass compositions and methods of making and using the same |
| abstract |
Hot-melt sealing glass compositions that include one or more glass frits dispersed in a polymeric binder system. The polymeric binder system is a solid at room temperature, but melts at a temperature of from about 35°C to about 900C, thereby forming a flowable liquid dispersion that can be applied to a substrate (e.g., a cap wafer and/or a device wafer of a MEMS device) by screen printing. Hot-melt sealing glass compositions according to the invention rapidly re¬ solidify and adhere to the substrate after being deposited by screen printing. Thus, they do not tend to spread out as much as conventional solvent-based glass frit bonding pastes after screen printing. And, because hot-melt sealing glass compositions according to the invention are not solvent-based systems, they do not need to be force dried after deposition. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-2765153-A1 |
| priorityDate |
2008-07-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |