| abstract |
Disclosed is a microstructure which has excellent long-term stability and can be bonded readily and at high bonding strength by thermocompression bonding. The microstructure comprises an insulating base material which has penetrating micropores each having a pore diameter of 10 to 500 nm at a density of 1 × 10 6 to 1 × 10 10 pores/mm 2 . In the inside of each of the penetrating micropores, a metal is filled at a filling rate of 30% or more. On at least one surface of the insulating base material, a layer comprising a polymer is arranged. |