| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e849b378d5e51e5af2e86c2933783f1d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47603d34b9625ee446326593b7ca193b |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T137-2224
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-16152
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2201-0214
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-10253
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-94
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2201-0278
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T137-2191
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-3025
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-1461
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-1433
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B01L3-502707
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01322
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2201-058 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01F1-8445
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00119 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81C1-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12 |
| filingDate |
2009-05-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4d4a15900bcfa0a21e65b0d01d9c5b24 |
| publicationDate |
2009-11-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2009140340-A1 |
| titleOfInvention |
Process of fabricating microfluidic device chips and chips formed thereby |
| abstract |
A process for fabricating multiple microfluidic device chips (50). The process includes fabricating multiple micromachined tubes (52) in a semiconductor device wafer (12). The tubes (52) are fabricated so that each tube (52) has an internal fluidic passage (16) and an inlet and outlet (18) thereto defined in a surface of the device wafer (12). The device wafer (12) is then bonded to a glass wafer (14) to form a device wafer stack (10), and so that through-holes (24) in the glass wafer (14) are individually fluidically coupled with the inlets and outlets (18) of the tubes (52). The glass wafer (14) is then bonded to a metallic wafer (26) to form a package wafer stack, so that through-holes (30) in the metallic wafer (26) are individually fluidically coupled with the through-holes (24) of the glass wafer (14). Multiple microfluidic device chips (50) are then singulated from the package wafer stack. Each device chip (50) has a continuous flow path for a fluid therethrough that is preferably free of organic materials. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-107764299-A |
| priorityDate |
2008-05-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |