| abstract |
The semiconductor component fabrication method comprises a step to prepare a semiconductor wafer on which protruding electrodes are formed on a functional surface, and a circuit board on which solder bumps are formed on one surface and electrode pads on the other surface, a bonding step to provide a resin layer with flux activity between the aforementioned semiconductor wafer and the aforementioned circuit board and to obtain a bonded body in which the aforementioned semiconductor wafer and the aforementioned circuit board are bonded together so that the aforementioned protruding electrodes and the aforementioned solder bumps make contact by penetrating the aforementioned resin layer with flux activity, a step to apply solder to the aforementioned electrode pads on the aforementioned bonded body, and a step to obtain multiple semiconductor components by cleaving the aforementioned bonded body. |