| abstract |
Disclosed is a heat conductive resin composition comprising (a) a matrix component, (b) a large particle-diameter heat conductive inorganic powder, (c) a small particle-diameter heat conductive inorganic powder, and (d) a vulcanizing agent and/or a curing agent. The small particle-diameter heat conductive inorganic powder is selectively surface treated with a silane compound represented by R(CH 3 ) a Si(OR') 3-a , wherein R represents an unsubstituted or substituted organic group having 6 to 20 carbon atoms, R' represents an alkyl group having 1 to 4 carbon atoms, and a is 0 or 1, or a partial hydrolyzate thereof in a smaller amount than an amount necessary for covering the whole surface area of the small particle-diameter heat conductive inorganic powder. According to the above constitution, the heat conductive resin composition is advantageous in that, even when a large amount of the heat conductive inorganic powder is filled into the resin component, the heat conductive resin composition can realize low hardness, high thermal conductivity, no significant evolution of outgas derived from the surface treating agent, and good storage stability. |