| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_2de927e401525996cb8bceb4b4003196
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_db3a8889081af465eabbc57f3d584fe1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e5db580deca7130dbe51805c6c608b35 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49155 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R1-07378 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R1-073
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-28 |
| filingDate |
2008-04-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d11a461663540437fafbb2202a4be4f6
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ced052f01d801aa7e9c1526d5503f2d1 |
| publicationDate |
2009-10-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2009130737-A1 |
| titleOfInvention |
Substrate for inspection, method for manufacturing substrate for inspection, and inspection method using the substrate for inspection |
| abstract |
On a surface of a substrate, a plurality of recessed sections are formed. The respective inner surfaces of the recessed sections are covered with electrically conductive films. The electrically conductive films are brought into contact with the bumps of a semiconductor element under inspection and are connected electrically with the bumps. This prevents the bumps from being damaged due to contact with a probe needle. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2011072076-A3
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2021036625-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-6990288-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8638114-B2 |
| priorityDate |
2008-04-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |