| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_95c1f2b690f70bc8cf5839aafa8f9d04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_9fd025af4c57fceb79ec26e2b663b54b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_79e90c33285355bbd8c02cd87d30c3f1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ead90443277482e25bf91bfddef2b5a7 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J2363-00 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-293
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-621
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J5-249
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J5-244 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-22 |
| filingDate |
2009-03-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7a51f35ad75c70180440104487f653f4
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_921e9587e5ebb0212421a9395740a19e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c683830d17cf78e1a793b620090a3bb5 |
| publicationDate |
2009-10-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2009123058-A1 |
| titleOfInvention |
Epoxy resin composition and molded object |
| abstract |
An epoxy resin composition having excellent moldability is provided. When combined with an inorganic filler, the epoxy resin composition gives a cured object which has a high thermal conductivity and low thermal expansion and is excellent in heat resistance and moisture resistance. The epoxy resin composition comprises an epoxy resin (A) and a hardener (B), wherein at least 50 wt.% of the epoxy resin is accounted for by a 4,4'-benzophenone epoxy resin and at least 50 wt.% of the hardener is accounted for by a 4,4'-benzophenone phenolic resin. In the composition, the ratio of the epoxy groups of the epoxy resin to the functional groups of the hardener is in the range of 0.8-1.5 by equivalent. This epoxy resin composition can contain 50-95 wt.% inorganic filler and is suitable for use in semiconductor encapsulation. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-3611208-A4
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-110506066-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-110506066-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013155234-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-3647346-A4
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012046616-A |
| priorityDate |
2008-03-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |