| abstract |
A method of manufacturing a substrate for a microelectronic device comprises providing a dielectric material (120, 220, 920) as a build-up layer of the substrate, applying a primer (140, 240, 940) to a surface (121, 221, 921) of the dielectric material, and forming an electrically conductive layer (150, 250, 950) over the primer. In another embodiment, the method comprises providing the dielectric material, forming the feature extending into the dielectric material, forming the electrically conductive layer over the dielectric material, applying the primer to a surface of the electrically conductive layer and attaching a dielectric layer (960) to the primer. |