| abstract |
The invention relates to a heatsink for an electrical or electronic device, to E&E devices comprising a heat source and a heatsink as well as to processes for producing the heatsink. The comprising a plastic body made of a thermally conductive plastic material comprising of an expanded graphite in an amount of at least 20 wt.%, relative to the total weight of the thermally conductive plastic material and/or has an in-plane thermal conductivity Λ // at least 7.5 W/m.K. The heat sink can be produced from the thermally conductive plastic material by interjection molding of the thermally conductive plastic material, optionally followed by applying a coating layer. In the E&E device the heatsink is assembled together with a heat source in heat conductive communication with each other. |