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filingDate 2009-01-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2009-09-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber WO-2009108404-A2
titleOfInvention Bottom-up assembly of structures on a substrate
abstract Examples of the present invention include methods of assembling structures, such as na- nostructures, at predetermined locations on a substrate. A voltage between spaced-apart electrodes supported by substrate attracts the structures to the substrate, and positional registration can be provided the substrate using topographic features such as wells. Examples of the present invention also include devices, such as electronic and optoelectronic devices, prepared by such methods.
priorityDate 2008-01-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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