| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a0aded3af9db7329d50f2c97fc284a2d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_cedeade83592fa8195ce8ca979b50d0f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_9fc0a00eab3a757e8324b1e887d7ba97
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_753e2010b8f6576be154fbef07893ab6
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4385cf58299c816f7f9521271bf7c81b |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-10113
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0317
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0116
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-056
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0393
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0557 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-027 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-027
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-28 |
| filingDate |
2008-12-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a4e4bcb0bb28b8195c1d0d82baa6d176
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1dcc34517cc8d378e5e37fb3b132c0b5
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_232d1c86987a565f8c3d72fc80b509e3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c5f3eaf46b50d2aca97bdb92355034ca |
| publicationDate |
2009-07-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2009085626-A1 |
| titleOfInvention |
Method to pattern metallized substrates using a high intensity light source |
| abstract |
A method for delineating a metallization pattern in a layer of sputtered aluminum or sputtered copper using a broad spectrum high intensity light source. The metal is deposited on a polymeric substrate by sputtering, so that it has a porous nanostructure. An opaque mask that is a positive representation of the desired metallization pattern is then situated over the metallization layer, exposing those portions of the metallization layer intended to be removed. The masked metallization layer is then exposed to a rapid burst of high intensity visible light from an arc source sufficient to cause complete removal of the exposed portions of the metallization layer, exposing the underlying substrate and creating the delineated pattern. |
| priorityDate |
2007-12-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |