Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_2f8c85db6395b6108e4257d0a9ad1530 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_24aca9ded2638ea793d05360dde7a4a0 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_535e95972efb122b574bc3ac8b7cebf2 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6ede3c505f324224e28753c54bd0e72c |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-0262 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-7786 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-8258 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-66318 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-737 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02463 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02502 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02433 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-0245 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02381 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02546 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02516 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-0605 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02639 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-331 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-737 |
filingDate |
2008-12-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e7d69f3b6af8c0961b0be36747a94e82 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8f1a71546ca7cd3f3ef52acb6836ffaf http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0c40c95e682eba6d6e597296e1d761ad |
publicationDate |
2009-07-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
WO-2009084239-A1 |
titleOfInvention |
Semiconductor substrate, method for producing semiconductor substrate, and electronic device |
abstract |
A high-quality GaAs crystal thin film is obtained by using a low-cost Si substrate having excellent heat dissipation characteristics. Specifically disclosed is a semiconductor substrate comprising an Si substrate, a Ge layer crystal-grown on the substrate and having an isolated island shape, a buffer layer crystal-grown on the Ge layer and composed of a P-containing group 3-5 compound semiconductor layer, and a functional layer crystal-grown on the buffer layer. The Ge layer is formed into an island shape which does not exceed twice the distance which crystal defects move when annealed at the annealing temperature and in the annealing time. Alternatively, the Ge layer is formed into an island shape which does not cause separation due to a stress caused by a difference in thermal expansion coefficient between the Ge layer and the Si substrate when annealed at the annealing temperature. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8592292-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9082817-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9064928-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2012056244-A1 |
priorityDate |
2007-12-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |