| abstract |
Disclosed is a modified dimethylnaphthalene formaldehyde resin which is excellent in heat resistance and useful as an electrically insulating material, a resin for resists, a semiconductor encapsulating resin, an adhesive for printed wiring boards, a matrix resin for prepregs or laminated boards for electrical use which are mounted on electric devices, electronic devices, industrial devices and the like, a buildup laminated board material, a resin for fiber-reinforced plastics, a sealing resin for liquid crystal display panels, a coating material, various coating agents, an adhesive and a thermosetting resin used for laminated boards for electric/electronic components, molded articles, coating materials, sealing materials and the like. Specifically disclosed is a modified dimethylnaphthalene formaldehyde resin which is obtained by modifying a polyfunctional dimethylnaphthalene formaldehyde resin having a structural unit represented by the general formula [1] below in a molecule with at least one compound selected from the group consisting of phenols represented by the general formula [2] below, naphthols represented by the general formula [3] below and naphthols represented by the general formula [4] below (provided that either a naphthol represented by the general formula [3] below or a naphthol represented by the general formula [4] below is always contained). |