| abstract |
Provided is a circuit member connecting adhesive for connecting circuit boards facing each other. The circuit member connecting adhesive is composed of a resin composition containing a thermoplastic resin, a thermosetting resin and a curing agent, and metal hydroxide particles dispersed in the composition. The circuit member connecting adhesive has excellent reliability in connection between a semiconductor chip and a substrate, and improves recognition performance of an alignment mark to be used for alignment of a semiconductor chip with a substrate to a level sufficient for practical use. |