http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2009058794-A2
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7186078942e01ea1b800da49769bec58 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1a34d7d2e0d09a58cb7bf4a04c81162e http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1b5db72614f4b79ff104bb721bfdf433 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L71-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-20 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L83-04 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L83-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G77-00 |
| filingDate | 2008-10-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_05fb8d39d780bca505f653edf5584176 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9f7c97282e2518eb1d28f07e4b73dc7a |
| publicationDate | 2009-05-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | WO-2009058794-A2 |
| titleOfInvention | Thermal interface materials, methods of production and uses thereof |
| abstract | Thermal interface materials comprise at least one silicon-based polymer and are formed from a combination of at least one silicon-based material, at least one catalyst and at least one elasticity promoter. In some embodiments, contemplated materials are also formed utilizing at least one polymerization component. Thermal interface materials are also disclosed that are capable of withstanding temperatures of at least 250C where the material comprises at least one silicon-based polymer coupled with at least one elasticity promoter. Methods of forming these thermal interface materials comprise providing each of the at least one silicon-based material, at least one catalyst and at least one elasticity promoter, blending the components and optionally including the at least one polymerization component. Contemplated thermal interface materials disclosed are thermally stable, sticky, and elastic, and show a good thermal conductivity and strong adhesion when deposited on the high thermally conductive material. The thermal interface materials may then be utilized as formed or the materials may be cured pre- or post-application of the thermal interface material to the surface, substrate or component. |
| priorityDate | 2007-10-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 38.