http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2009057638-A1

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filingDate 2008-10-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_74633963e43f3fbb80dddcfbd3769d1f
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publicationDate 2009-05-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber WO-2009057638-A1
titleOfInvention Positive photosensitive resin composition, method for forming pattern, electronic component
abstract Disclosed is a positive photosensitive resin composition which can be developed with an aqueous alkali solution and enables to obtain a pattern which is excellent in heat resistance and mechanical characteristics, while having a good shape. Also disclosed are a method for forming a pattern and an electronic device. Specifically disclosed is a positive photosensitive resin composition containing (a) a polybenzoxazole having a structural unit represented by the general formula (1) or (2) and satisfying the conditions (i) and/or (ii) or a polymer serving as a precursor thereof, (b) a compound generating an acid when irradiated with an active ray, and (c) a compound having a structure represented by the general formula (3) which is crosslinkable or polymerizable with the component (a) by heat.
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2017134701-A1
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Total number of triples: 42.