| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_62c4be508c6b4305538255a0b0878bc3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_cfaff4a0d323fd1360ebec8c27ceb1f8
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ca127eee691d9d73dfbc97b7957ed836
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_371290089320f9469a0809aea17b2a22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_875b2225b6a8e7bd618f81a60007dd62
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_bce787970b69aeb08d159e7c101c9ed7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1bf44eabe9ec2795b5e0bfc9ddeaf3f5
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_17fb2bb353d82990f556401193e89cd5
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e7efb749c99667c9f7f9cca6575cd329
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5bf2742497f861cedc8a5d7a08b49650 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76832
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76834
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-7681
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76883
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76849
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76826
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53295
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53238 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-48 |
| filingDate |
2008-10-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_795e212e3e399d8351b0b8dd6d619f37
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a230cf03febee01a869450b530763832
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1be345ba73aa62d3cf4864c9a8f09393
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_28496c4b2f2b0afd0bca67f7ca665bb4
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cadb36cccf700cdc529ccefb57e92e64
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_675a7b7dca01b309e27d48c6f290dccc
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c3a80c0090452299105c8ba99b2cad8b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0e91af3c31806e138dfcb65ae3f22d9c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6c383820ec742a79b7dfc0a48b6dac65 |
| publicationDate |
2009-04-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2009055450-A1 |
| titleOfInvention |
Adhesion improvement of dielectric barrier to copper by the addition of thin interface layer |
| abstract |
Embodiments described herein provide a method of processing a substrate. The method includes depositing an interface adhesion layer between a conductive material and a dielectric material such that the interface adhesion layer provides increased adhesion between the conductive material and the dielectric material. In one embodiment a method for processing a substrate is provided. The method comprises depositing an interface adhesion layer on a substrate comprising a conductive material, exposing the interface adhesion layer to a nitrogen containing plasma, and depositing a dielectric layer on the interface adhesion layer after exposing the interface adhesion layer to the nitrogen containing plasma. |
| priorityDate |
2007-10-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |