| abstract |
This invention provides an electroconductive pressure-sensitive adhesive tape comprising a pressure-sensitive adhesive layer having a thickness of 10 to 30 µm. The pressure-sensitive adhesive layer is formed of a pressure-sensitive adhesive containing spherical and/or spike-like electroconductive fillers having an aspect ratio of 1.0 to 1.5. The amount of the electroconductive fillers is 14 to 45 parts by weight based on 100 parts by weight of the total solid content of the pressure-sensitive adhesive excluding the filler. Not less than 90% by weight of all the fillers in the pressure-sensitive adhesive is accounted for by the electroconductive filler. The pressure-sensitive adhesive tape is characterized in that the particle diameter of the electoconductive filler (d50, d85) and the thickness of the pressure-sensitive adhesive layer satisfy a relationship of d85 > thickness of pressure-sensitive adhesive layer > d50. The electroconductive pressure-sensitive adhesive tape, even when the thickness of the pressure-sensitive adhesive layer is reduced, possesses excellent pressure-sensitive adhesive properties and electroconductive properties. Further, the electroconductive pressure-sensitive adhesive tape, even when applied to a step difference part, has a step difference absorbing property high enough to avoid “lifting” from an adherend. Accordingly, the electroconductive pressure-sensitive adhesive tape is useful, for example, for the production of electric and electronic apparatuses and the like. |