http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2009029119-A1

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filingDate 2007-10-31-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_02cd9cee95388ead1041311328303091
publicationDate 2009-03-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber WO-2009029119-A1
titleOfInvention Laser circuit etching by subtractive deposition
abstract In one embodiment the present invention includes a direct-write laser lithography system. The system includes a reel-to-reel feed system that presents the clear film-side of a single-sided metal-clad tape to a laser for direct patterning of the metal. The laser beam is swept laterally across the tape by a moving mirror, and is intense enough to ablate the metal but not so strong as to destroy the tape substrate. The ablated metal becomes deposited to form circuit structures on a target structure.
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