Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d8003e5b7105512d183c28196608658b |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0528 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-107 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-046 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B44C1-22 |
filingDate |
2007-10-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_02cd9cee95388ead1041311328303091 |
publicationDate |
2009-03-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
WO-2009029119-A1 |
titleOfInvention |
Laser circuit etching by subtractive deposition |
abstract |
In one embodiment the present invention includes a direct-write laser lithography system. The system includes a reel-to-reel feed system that presents the clear film-side of a single-sided metal-clad tape to a laser for direct patterning of the metal. The laser beam is swept laterally across the tape by a moving mirror, and is intense enough to ablate the metal but not so strong as to destroy the tape substrate. The ablated metal becomes deposited to form circuit structures on a target structure. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-2893781-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10688692-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2015056253-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2014045088-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10633758-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-2893781-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/IT-MI20121541-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10907301-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10193004-B2 |
priorityDate |
2007-08-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |