| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f3e9cf7387c5d7c2f45d8efa8ac55523
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_581f284ded78643ba826989e49935c87
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_82477e1ad37d8538a146a6129facce05 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D7-261
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D11-0047
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02071
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D7-3218
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D7-3209
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D7-5009
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D7-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-30604
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-425
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-422
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-426
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31133 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C11D7-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C11D3-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C11D3-33
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-30 |
| filingDate |
2008-08-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_99197feaad04b1201b4675ac2d18e6cf
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a296cf5de09c7ffebc879da7d355577a |
| publicationDate |
2009-02-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2009023675-A2 |
| titleOfInvention |
Improved metal conservation with stripper solutions containing resorcinol |
| abstract |
Resist stripping agents useful for fabricating circuits and/or forming electrodes on semiconductor devices for semiconductor integrated circuits and/or liquid crystals with reduced metal and metal alloy etch rates (particularly copper etch rates and TiW etch rates), are provided with methods for their use. The preferred stripping agents contain low concentrations of resorcinol or a resorcinol derivative, with or without an added copper salt, and with or without an added amine to improve solubility of the copper salt. Further provided are integrated circuit devices and electronic interconnect structures prepared according to these methods. |
| priorityDate |
2007-08-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |