http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2009022437-A1

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filingDate 2007-08-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dc004299868c0d83ac075ffcdc69dd54
publicationDate 2009-02-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber WO-2009022437-A1
titleOfInvention Wiring and method for manufacturing the same and electronic components and related electronic equipment
abstract The present invention relates to wiring using a patterned monostratal conductive fine particle film in which the selectively formed monostratal conductive fine particle film is covalently bound to the surface of the base material via a first organic coating selectively formed on the surface of the base material and a second organic coating formed on the surface of the conductive fine particles, and further the wiring comprises the foregoing organic coatings that are different from each other.
priorityDate 2007-08-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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