| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_df9ea549bf98b366b9b9ae1df12892cf
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_aad78f9cb18d4156b49d831283284e37
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_33c922e05f6133b7d72dbb849d77487d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_bf2f2f3e351ea58209e638fa69379000
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_bf802cfbf1faf36796da9513a4b03ab5 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0209
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-097
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-092
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1131
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-107 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-1283
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-102
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-105
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-268
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-288 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-28 |
| filingDate |
2008-07-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_52c45ad796ec256bf5806600221a7ac7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ea78574a162409359e295e2c311bd1a2
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_690eab00a5f1f11fbbc8fb83fb5502ea
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5cd60ef1bc104f3d8730ea46b8bb22e0 |
| publicationDate |
2009-03-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2009014391-A3 |
| titleOfInvention |
Preparation method of electroconductive copper patterning layer by laser irradiation |
| abstract |
A preparation method of an electroconductive copper patterning layer includes (Step 1) preparing a dispersion solution of copper-based particles selected from the group consisting of copper particles, copper oxide particles, and their mixtures; (Step 2) forming a copper-based particle patterning layer by printing or filling the dispersion solution of copper-based particles to a substrate into a predetermined shape; and (Step 3) irradiating laser to the copper-based particle patterning layer to burn and interconnect the copper-based particles contained in the copper- based particle patterning layer. This preparation method burns a copper-based particle patterning layer with a strong energy within a short time by using laser. Thus, it is possible to obtain a copper patterning layer that is hardly oxidized even in the atmosphere, so a copper patterning layer with excellent electric conductivity is formed. |
| priorityDate |
2007-07-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |