| abstract |
Disclosed is an epoxy resin composition characterized by containing a solid epoxy resin (A) having an aromatic ring content of 5-40%, which is obtained by reacting a bifunctional epoxy resin (a) having an epoxy equivalent weight of 120-350 g/eq with a polyester compound (b) having 1.2-1.8 carboxyl groups per one molecule, and a curing agent (B). A cured product obtained by curing such a composition is excellent in heat resistance, moisture resistance and crack resistance, and thus it is useful in the field of electronic materials such as optical semiconductor sealing materials, in particular LED sealing materials. |