| abstract |
Disclosed is a copper foil with resin layer, which enables to secure good adhesion between the copper foil and a base resin layer in a resin substrate for flexible printed wiring boards using a copper foil wherein the copper foil is not subjected to a roughening treatment. Specifically disclosed is a copper foil with resin layer, which is characterized in that a copper foil which is not subjected to a roughening treatment and a resin layer containing a phenolic hydroxy group-containing aromatic polyamide resin having a structure represented by the formula (1) below are directly bonded with each other. (1) (In the formula (1), m and n satisfy 0.005 ≤ n/(m + n) < 0.05 on the average with m + n being 2-200; Ar1 represents a divalent aromatic group; Ar2 represents a divalent aromatic group having a phenolic hydroxy group; and Ar3 represents a divalent aromatic group.) |