| abstract |
Disclosed is a silicon-containing compound represented by the general formula (0) below. Also disclosed is a curable composition containing 0.01-20 parts by mass of an epoxy curable compound per 100 parts by mass of the silicon-containing compound. This curable composition enables to obtain a cured product having excellent heat resistance and flexibility. (In the general formula (0), Ra-Rg each represents a C1-12 saturated aliphatic hydrocarbon group or a C1-12 aromatic hydrocarbon group; Y represents a C2-4 alkylene group; Z represents a group represented by one of the formulae (2)-(6) shown above; K represents a number of 2-7; T represents a number of 1-7; P represents a number of 0-3; and M and N represent numbers satisfying the following relation: N:M = 1:1-1:100, with the total of all M's and all N's being not less than 15, which make the mass average molecular weight of the compound to be 3,000-1,000,000. In the formulae (2)-(6), Xa-Xc each represents a C1-8 alkanediyl group, a -COO- group or a single bond; Rh-Rj each represents a hydrogen atom or a methyl group; and r represents 0 or 1.) |