| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_27652c88758a741ef03fbc9f6852746b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_65147f09c27bafad8eaa268c044a25ff |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-24612 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F290-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D183-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0757
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-58
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F290-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F283-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L83-06 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G77-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F290-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-075
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-027 |
| filingDate |
2008-03-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9536308103a5e42b40945658e987e48b |
| publicationDate |
2008-10-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2008123224-A1 |
| titleOfInvention |
Photosensitive resin composition |
| abstract |
A photosensitive resin composition comprising a photosensitive silicone compound of specified molecular weight having any of specified photosensitive substituents and a photopolymerization initiator in any of specified proportions. Thus, there can be obtained a resin composition containing a photosensitive silicone compound that provides a material suitable for a rewiring layer or buffer coat material of LSI chip, less in a film loss between before and after curing and improved in the stickiness of pre-exposure stage. Further, there can be obtained a resin insulating film utilizing the resin composition. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2017525834-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010031272-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010047746-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2012050201-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2009078336-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2012050201-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-5525821-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8475996-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2010209669-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-103154053-A |
| priorityDate |
2007-04-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |